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Original Articles

The Effects of Silicone Contamination on Bond Performance of Various Bond Systems

, , , , &
Pages 1159-1177 | Received 15 Jan 2010, Accepted 15 Jul 2010, Published online: 01 Dec 2010
 

Abstract

The sensitivity to silicone contamination of a wide variety of adhesive bond systems is discussed. Generalizations regarding factors that make some bond systems more sensitive to contamination than others are inferred and discussed. The effect of silane adhesion-promoting primer on the contamination sensitivity of two epoxy/steel bond systems is also discussed.

Notes

Test geometries: B/P is button-to-panel; B/B is button-to-button; QSL is quadruple lap shear.

Failure mode: coh is cohesive in the adhesive of substrate specified; adh is interfacial between the adhesive and the substrate.

One of a Collection of papers honoring David A. Dillard, the recipient in February, 2010 of The Adhesion Society Award for Excellence in Adhesion Science, Sponsored by 3M.

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