A Low Modulus Adhesive Characterization by Means of DMTA Testing

Abstract

The main objective of this paper is to investigate a way to characterize experimentally the mechanical behavior of low modulus adhesives. In this context, the relaxation and complex moluli master curves of a SIKAFLEX® 505 adhesive are obtained by means of dynamic mechanical thermal analysis. Firstly, the procedure carried out to prepare and to validate the test specimens is explained. Next, the influence of the test specimen thickness and strain level is studied. Finally, the relaxation and dynamic master curve sunder tension strain are constructed via a procedure based on the time-temperature superposition principle.

KEYWORDS:

• Adhesives
• Complex modulus
• Relaxation modulus
• Time-temperature superposition principle

ACKNOWLEDGMENTS

The work presented in this paper was carried out with the generous financial support of ORONA SCOOP in Spain and the Education Department of the Basque Government.

Also the equipment and knowledge provided by the School of Engineering, university of Oviedo, Gijón, Spain and its members are gratefully acknowledged.

Notes

Presented in part at the 1st International Conference on Structural Adhesive Bonding (AB2011), Porto, Portugal, 7–8 July 2011.