Curie-supported accelerated curing by means of inductive heating – Part I: Model building

ABSTRACT

Accelerating the polymerisation of adhesives has been a long-established field of research in context of adhesive bonding technology as long curing times – sometimes up to days – represent a decisive disadvantage in contrast to most mechanical joining techniques like riveting or screwing. In addition to, e.g., curing via UV, microwave or IR radiation, electromagnetic induction represents a promising solution for speeding up the cure of polymers. With this method, adhesively bonded components are subjected to an alternating electromagnetic field (EMF) that induces heat in EMF-sensitive materials, e.g., steel or aluminium. If intrinsic EMF-sensitivity of the materials to be bonded is not given, different types of susceptors like meshes, fibres or particles are added to the adhesive in order to be heated inductively and thus cure the adhesive from the inside. Recent research has focused on a special type of susceptors, so-called Curie particles (CP), which can only be heated inductively up to their specific Curie temperature (T_c) at which CP-induced heating automatically stops. As a result, a curing process is created that eliminates the need for external temperature monitoring while simultaneously preventing overheating of the bond. As underlying curing kinetics – most importantly polymerisation enthalpy and curing time – significantly differ depending on the considered adhesive, induction times needed to achieve full cure must currently be determined through costly preliminary investigations on an experimental level. Thus, to contribute for a more efficient and controllable bonding process, the present study aimed at developing a numerical model based on the Finite Element Method (FEM) and capable of predicting the curing degree α in dependency of curing temperature profiles T_Cure(t) and the CP content c_cp. For this purpose, the curing kinetics of two fundamentally different 2K epoxy adhesives were linked to a transient heat flow simulation based upon experimentally determined heat loads. The validation of the developed FEA technique was successfully carried out using the example application of inductively cured large-scale Glued-in rod (GiR) specimens, whereby experimentally determined temperature profiles showed excellent agreement with the numerical predictions. The present paper focused on presenting preliminary experimental work as well as all analytical methods implemented for the numerical modelling.

KEYWORDS:

• Accelerated curing
• curie-particles
• curing kinetics
• glued-in-rods
• inductive heating
• numerical modelling

Acknowledgements

Parts of this work were financially supported by the Forschungsvereinigung Internationaler Verein für Technische Holzfragen e.V. (iVTH) program IGF – 19259N funded by the German Federal Ministry for Economic affairs and Energy.

Additional information

Funding

This work was supported by the Allianz Industrie Forschung [19259N].