Preparation and Properties of BN/Si₃N₄/Epoxy Composites

Abstract

The effect of a hybrid filler on the thermal conductivity of an epoxy composite is described. The hybrid filler, containing boron nitride (BN) particles and silicon nitride (Si₃N₄) whiskers with different wt% ratios (20:0, 18:2, 15:5, 10:10, 5:15, 2:18 and 0:20), was loaded into the epoxy resin. The thermal conductivities of the doped composites were higher than that of the pure EP (0.4287 W·m⁻¹·K⁻¹); with addition of BN and Si₃N₄ fillers the 10%BN/10%Si₃N₄/EP composites exhibited the highest thermal conductivity (1.1486 W·m⁻¹·K⁻¹), which was 185% and 214% that of the 20%BN/EP composite (0.6200 W·m⁻¹·K⁻¹) and the 20%Si₃N₄/EP (0.5374 W·m⁻¹·K⁻¹), respectively. The impact strength of the composite material 10%BN/10%Si₃N₄/EP also was the maximum (3.48 KJ/m²). Thus, the 10%BN/10%Si₃N₄/EP composites not only exhibited excellent thermal conductivity, but also slight improvements in thermal stability and impact strength. Suggesting it would be useful for thermal sensor interconnections of electronic circuits.

Keywords:

• epoxy composite
• hybrid filler
• thermal conductivity

Additional information

Funding

This work was financially supported by the Cooperation Project of Guizhou Province (Grant No. LH [2016]7441).