Preparation and Evaluation of Epoxy Based Material for High Performance Electronic Packaging through the Surface Modification of Fillers

Abstract

The continuous integration and refinement of electronic equipment results in the more stringent requirements for epoxy resin (EP) based materials, such as excellent heat dissipation and low coefficient of thermal expansion (CTE). In order to improve the dispersion of silica powder (SP) in EP and thus expand the application of EP in the field of electronic packaging, our research described in this paper adopted the KH-550 coupling agent to modify the surface of SP (m-SP). The effects of KH-550 coupling agent on the characteristics of the composites were investigated in terms of thermal, rheological, electrical insulation and mechanical properties. The results showed that when the content of KH-550 was 2 wt% of the fillers, the best modification effect was achieved, and the surface properties of the fillers were changed accordingly. In particular, the materials filled with m-SP exhibited lower viscosity end, better mechanical and electrical insulation properties. It was also found that the adding of the KH-550 had different effects on the thermal degradation, dynamic thermo-mechanical properties and the thermal deformation behavior of the materials. According to our study, the thermal conductivity and the CTE of m-SP/EP filled with 70 wt% of modified fillers were 0.787 W/m.K and 28.3 ppm/°C respectively, corresponding to a significant thermal conductivity improvement and low CTE.

Keywords:

• KH-550 coupling agent
• Epoxy resin
• Filler modification
• Low coefficient of thermal expansion
• Thermal conductivity

Acknowledgments

The people involved in this article are listed in the author directory, and we also thank the anonymous reviewer for their valuable comments.

Disclosure statement

No potential conflict of interest was reported by the authors.