166
Views
5
CrossRef citations to date
0
Altmetric
Original Articles

Effect of Ce on resistivity of Sn-3.8Ag-0.7Cu-xCe lead-free solders

, , , , , , & show all
Pages 37-41 | Received 23 Mar 2015, Accepted 02 Jun 2015, Published online: 24 Jul 2015
 

Abstract

The electrical resistivity of Sn-3.8Ag-0.7Cu-xCe (x takes 0, 0.2, 0.5 and 1.0 weight per cent) alloy as a function of temperature was measured by DC four-probe technique. Abnormal changes occurred on the resistivity–temperature (ρT) curves above the liquidus, which suggested that the temperature-induced liquid–liquid structure transition probably occurred in Sn-3.8Ag-0.7Cu-xCe melt, with some reversible characters. With the increasing of Ce, the melting range was expanded from 13.0°C to 24.2°C, and the resistivity increased sharply when the Ce composition increased to 0.2%, and then declined slightly. In addition, the temperature and behaviour of abnormal zone were affected by the different additions of Ce.

Log in via your institution

Log in to Taylor & Francis Online

PDF download + Online access

  • 48 hours access to article PDF & online version
  • Article PDF can be downloaded
  • Article PDF can be printed
USD 61.00 Add to cart

Issue Purchase

  • 30 days online access to complete issue
  • Article PDFs can be downloaded
  • Article PDFs can be printed
USD 1,616.00 Add to cart

* Local tax will be added as applicable

Related Research

People also read lists articles that other readers of this article have read.

Recommended articles lists articles that we recommend and is powered by our AI driven recommendation engine.

Cited by lists all citing articles based on Crossref citations.
Articles with the Crossref icon will open in a new tab.