Abstract
The heat transfer and fluid flow characteristics of microchannel with discrete double inclined ribs on sidewalls is performed numerically. A three-dimensional numerical model of the microchannel is constructed and studied. To obtain the optimal microchannel, four structural parameters of the rib length, angle, thickness, and height are changed by the orthogonal test method. In addition, four structural parameters of the rib are investigated separately on the heat transfer and fluid flow characteristics of the microchannel, Nusselt number, friction factor and performance evaluation criterion of the microchannel are calculated with Reynolds number ranging from 200 to 600. Results indicate that the microchannel with discrete double inclined ribs on sidewalls exhibits superior thermal characteristics, which shows a 58.13% reduction in temperature difference between the maximum temperature and the inlet temperature compared to the straight-through channel. Furthermore, all four structural parameters of the rib have varying degrees of effect on the heat transfer and fluid flow characteristics of the microchannel.
Acknowledgments
The authors would like to acknowledge the Key R&D Plan of Jiangsu Province (Grant No. BE2020083, BE2020083-4), the National Natural Science Foundation of China (Grant No. 61404114), and the Innovation Technology Platform Project jointly built by Yangzhou City and Yangzhou University (Grant No. YZ2020268).
Disclosure statement
The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
Additional information
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Xichen Zhang
Xichen Zhang is a master student in the College of Physics Science and Technology from Yangzhou University. His research interest involves the numerical simulation of heat dissipation in microchannel heat sink for semiconductor laser diodes.
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Liwen Cheng
Liwen Cheng is a Professor in the College of Physics Science and Technology and Microelectronics Industry Research Institute of Yangzhou University, China. He received the B.S. degree in electrophysics from JiLin University, Changchun, China, in 2005, the M.S. degree in condensed matter physics from the Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China, in 2008, and the Ph.D. degree in Microelectronics and Solid-State Electronics from the Shanghai Institute of Technical Physics of The Chinese Academy of Sciences, Shanghai, China in 2012. His research interest involves the design and numerical simulation of semiconductor photoelectronic devices.