Analysis of transient plane thermal stresses in functionally graded orthotropic strip

Abstract

This research is concerned with the transient plane thermoelastic problems in functionally graded orthotropic materials. The material properties such as the specific heat c, the density ρ, the thermal conductivities λ_x and λ_y, the coefficients of linear thermal expansion α_x and α_y, Young’s moduli E_x and E_y in x and y directions, respectively, are assumed to be functions of position (x). Laplace transform and separation of variables are used to analyze the temperature field in functionally graded orthotropic strips. The stress function is used for the plane thermoelastic problem in the functionally graded orthotropic materials. As a specific example, functionally graded orthotropic strip was analyzed. Numerical results are shown for the effects of orthotropy of material properties on temperature and thermal stresses. They show that the effects of orthotropy on temperature and thermal stresses are very large. The proposed analytical method is useful in the design of structures exposed to severe temperature environment. As a specific example, functionally graded orthotropic strip was analyzed.

Keywords:

• Functionally graded orthotropic materials
• strip
• stress function
• thermoelastic problems
• transient problem

Disclosure statement

There is no conflict of interest as reported by the authors.