Bond durability of contemporary universal adhesives: effect of dentin treatments and aging

Abstract

The aim of this in vitro investigation was to evaluate the effects of different dentin treatments on µTBS values of three different universal adhesives. Sixty extracted bovine incisors were used. The teeth were horizontally sectioned from the enamel-cement junction and embedded in an acrylic resin. Enamel was removed with 180-grit SiC paper to expose dentin. The exposed dentin surfaces were further polished with 600-grit SiC paper to provide a standardized smear layer. Teeth were randomly divided into three groups, according to the universal adhesives: All-Bond Universal, Single Bond Universal, and G-Bond Plus. Each group was then assigned into four subgroups, according to the dentin treatments: etch-and-rinse mode (ER), ER + 2% chlorhexidine (CHX), ER + %2.5 genipin (GE), and self-etch mode (SE). Samples were longitudinally sectioned across the bonded-interfaces to obtain resin-dentin beams. Beams were prepared from the same teeth were randomly and equally divided into two groups: immediate µTBS testing and µTBS testing after 6-month. The failure loads were recorded in MPa, and failure modes were evaluated at 30× magnification. The data were analyzed using a two-way ANOVA, to determine the effects of dentin treatment and storage time, and the interaction of these two factors on the µTBS of universal adhesives. Dentin treatments were showed significant differences (p < 0.05). ER mode exhibited higher µTBS than SE mode. However, universal adhesives were more durable in the SE mode than ER mode. Also, chlorhexidine treatment significantly improved adhesive performance of all universal adhesives, while no significant improvement was detected with genipin treatment.

Keywords:

• Universal adhesives
• chlorhexidine
• genipin
• durability
• bond strength

Clinical relevance

Considering higher microtensile bond strength values and incidence of failure types, the dentin treatment with chlorhexidine would be beneficial for universal adhesives when applied etch-and-rinse mode.

Disclosure statement

The author did not has any commercial interest in any of the materials used in this study.