Abstract
This study investigates the effects of different recipes and concentrations of surfactant on the texture and reflectance of a multi-crystalline silicon wafer surface. The morphology of the surface was examined and photographed using a field emission scanning electronic microscope. The reflectance of the surface was measured and analyzed using a self-designed optical system. The results of this study show that a higher hydrocarbon-surfactant (CH-surfactant) concentration in the etchant resulted in a slower reaction time. The optimum concentration of CH-surfactant was 1%. However, there were many white bubbles in the etching process. The optimum recipe for surfactant included fluoride 2% to diminish these bubbles. The reflectance was less than 22% in visible light. This cost effective acid chemical etching method is suitable for texturing silicon surfaces on 50 nm nanostructures. This is a critical criterion for determining the optimum recipe for surface texturing of acidic etching in solar cells.
Acknowledgments
This study was sponsored by funding from the National Science Council of Taiwan, NSC 98-2221-E159-013.