370
Views
0
CrossRef citations to date
0
Altmetric
This article refers to:
Investigation of the microstructure and toughness of 550 MPa grade pipeline after the hot-bending process

X. L. Wang, Y. T. Tsai, J. R. Yang, C. J. Shang, X. M. Wang, L. M. Dong and W. W. Yang: ‘Investigation of the microstructure and toughness of 550 MPa grade pipeline after the hot bending process’, Mater. Sci. Technol., 2015, http://dx.doi.org/10.1080/02670836.2015.1118793.

When the above article was first published online, J. R. Yang's affiliation was listed as ‘Institute of Research of Iron and Steel, Shasteel, Zhangjiagang, Jiangsu, China’.

J. R. Yang's correct affiliation is ‘Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan’.

This has now been corrected in both the online and print versions of this paper.

Taylor & Francis apologises for this error.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.