Substrate effect on electrodeposited copper morphology and crystal shapes

ABSTRACT

Copper has been electrodeposited on copper (FCC) and mild steel (BCC) substrates from acidic sulphate bath with and without cetyl trimethyl ammonium bromide at 0.25, 2, 6 and 9 V. It is found that the surface morphology varies with the change in overpotential, but not with the change in substrate. On the contrary, the crystal shape is found to be independent of the applied overpotential, but varies with the bath chemistry or choice of substrate.

KEYWORDS:

• Electrodeposition
• equilibrium crystal shape
• morphology
• overpotential
• bath chemistry
• substrate

Disclosure statement

No potential conflict of interest was reported by the authors.