Maskless copper electroplating on stainless steel using DPSS green laser

ABSTRACT

In this paper selective deposition of copper on the steel substrate is described by the laser enhanced electroplating method from liquid phase i.e. aqueous copper sulphate solution. The present study involves (i) identification of suitable laser wavelength (i.e. frequency doubled Nd: YAG laser at 532 nm) with low absorption in the electrolyte, (ii) determination of threshold voltage for selective deposition with laser, (iii) experiments on laser-assisted selective copper electroplating and (iv) characterisation based on dimensions, surface topography, residual stresses and phases present. Thus formed deposits can be controlled by incident laser power density and build up growth increases with plating time.

KEYWORDS:

• Laser
• electroplating
• maskless plating
• copper

Acknowledgement

Authors are extremely thankful to Mr R. Sundar for many useful discussions and suggestions during planning of the experiments. They are thankful to Dr S. K. Rai for XRD measurements and Shri M. K. Singh for SEM image. They wish to thank Dr B. T. Rao and Mr P. Kumar Agrawal for their help during initial experimentation. Authors express their sincere thanks to Mr D. C. Nagpure and Mr Ram Nihal Ram for their help during various stages of the study.

Disclosure statement

No potential conflict of interest was reported by the authors.