Simulation of Adhesive–Dissipative Behavior of a Microparticle Under the Oblique Impact

Abstract

The adhesive–dissipative behavior of a microparticle under the oblique impact is investigated numerically and the new discrete element method (DEM)-compatible interaction model is elaborated. The modeling approach is based on the Derjaguin–Muller–Toporov model of normal interaction for the adhesive elastic contact. Adhesion hysteresis is specified by the loss of the kinetic energy governed by the fixed amount of the adhesion work, required to separate two adhesive contacting surfaces. This effect is captured in the new interaction model by adding an additional dissipative force component to normal contact during unloading and detachment. The essential feature of this approach, differing from that of the viscous damping model, is that, according to the proposed method, the amount of the dissipated energy is not influenced by the actual initial velocity during the entire contact. The influence of adhesion on slip friction is reflected by considering the adhesive normal force components in the Coulomb's law of friction. The contribution of the adhesion-related dissipation is illustrated by a comparison of the behavior of the attractive–dissipative and attractive–non-dissipative models. The oblique impact of a microparticle on the plane surface at the intermediate impact angle is also investigated numerically. The link between adhesion and friction is supported by the numerical results.

Keywords:

• Adhesion hysteresis
• contact mechanics
• DEM
• dissipation
• microparticle
• oblique impact

Notes

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