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Original Articles

Study of Curing Kinetics of an Epoxy-Amine Adhesive System Using a Calorimetric Analysis Approach

Pages 1109-1116 | Published online: 28 Oct 2008
 

Abstract

Various dynamic curing experiments for an epoxy-amine adhesive system were conducted using a differential scanning calorimetry. The obtained data were corrected using a proposed baseline method, and fitted to a generalized autocatalytic model of chemical reaction to determine the model parameters. It was shown that with classical fourth-order Runge-Kutta numerical algorithm, the kinetic model as derived from the dynamic experiments could be used to reliably simulate an industrial curing process, which may include nonisothermal and quasi-isothermal curing steps. In addition, various quasi-isothermal curing experiments were performed; the heat flows of cure were measured, and numerically compared with relevant model calculations.

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