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Original Articles

Optimization and Development of O-shaped Triple-band Microstrip Patch Antenna for Wireless Communication Applications

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Pages 95-105 | Published online: 19 Jun 2014
 

ABSTRACT

In this work, a triple-band patch antenna for wireless communication applications has been proposed. For designing an antenna with suitable resonance characteristics to cover many frequency bands simultaneously, a strip is coupled on the right side of an O-shaped patch element and ground plane has been modified with an inverted L-slot and two unequal slits. The proposed design resonates in three different bands, viz. 2.35–2.86, 3.0–4.3, and 5.64–6.85 GHz with respective bandwidths of 510 MHz, 1.3 GHz, and 1.21 GHz. Obviously, the achieved bands are suitable to cover wireless local area network/industrial, scientific and medical band, Bluetooth, Globalstar satellite phone uplink, worldwide interoperability for microwave access, International Mobile Telecommunication, intelligent transport systems, and satellite communication. The overall size of the proposed antenna is 35 × 30 mm2. The fabrication and measurement of parameters of proposed structure was carried out to verify the simulated results. Finally, complete geometrical method for the design of O-shaped microstrip patch antenna with modified ground plane is presented.

Acknowledgement

The authors are thankful to Mr J. Malik, Research Scholar, I.I.T. Roorke, India, for his endless support and co-operation during this entire research work.

Additional information

Notes on contributors

Jaswinder Kaur

Jaswinder Kaur received her BTech and MTech degrees in electronics & communication engineering from Punjab Technical University, Jalandhar, in 2005 and 2009, respectively. She is currently working as a lecturer at Electronics and Communication Engineering Department, Thapar University, Patiala, Punjab, India. She is also pursuing her PhD degree from Thapar University, Patiala. Her research interests include the analysis and design of microstrip patch antennas and wireless communication. She has sixteen publications, in national and international peer reviewed journals/conference, to her credit.

E-mail: [email protected]

Rajesh Khanna

Rajesh Khanna received his BSc (Engg.) degree in electronics & communication in 1988 from Regional Engineering College, Kurukshetra, Haryana, India, and ME degree in 1998 from Indian Institute of Sciences, Bangalore, India. Presently, he is working as a professor and head of the Department of Electronics & Communication, Thapar University, Patiala, Punjab, India. He has published 80 papers in national and international journals/conferences. He has research projects worth Rs 1.5 crores to his credit. His research interests include the analysis and design of antennas, wireless communication, multiple input multiple output (MIMO), and fractional Fourier transform-based wireless systems.

E-mail: [email protected]

M. V. Kartikeyan

M. V. Kartikeyan is working as a professor in the Department of Electronics and Computer Engineering, Indian Institute of Technology, Roorkee, Uttarakhand, India. He has completed his masters and PhD degrees from BHU, Varanasi, India. He has served as a research scientist at Central Electronics Engineering Research Institute, Pilani, India, for the period 1989–2001. He has worked as a research scientist at Institut Fuer Hochleistungsimpuls, Germany, from 2001 to 2003. He is an active member of various organizations including IEEE (USA), IETE (India), IE (India), VEDAS (India), and PSSI (India). He has published 60 papers in journals and 155 papers in conferences of national and international repute. He has authored a book titled Gyrotrons – High Power Microwave and Millimeter Wave Technology published by Springer-Verlag, New York. He has received nearly of 3.5 crores as grant from different agencies for carrying out projects related to his area of interest. His research interests include high power millimeter & THz wave engineering, microstrip antennas for communications, microwave integrated circuits (MICs) and microwave & RF design with soft computing techniques.

E-mail: [email protected]

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