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Electromagnetics

Design and Analysis of Metamaterial-Based SWB-MIMO Antenna

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Pages 6733-6746 | Published online: 13 Jan 2022
 

Abstract

The design and analysis of a four-port multi-input multi-output (MIMO) super wideband antenna (SWB) with a metamaterial superstrate are proposed. Initially, a single antenna is constructed with a hexagonal radiator loaded with dodecagon slots along with a slotted partial ground. An impedance bandwidth of 4.1–14.7 GHz is achieved by using symmetric coplanar waveguide feeding technique and three iterations of dodecagon slot-loaded radiating element. The design is extended to a 2 × 2 MIMO antenna with dimensions 50 × 50 × 1.6 mm3. The four symmetrical SWB antennas are placed orthogonally to each other at four corners of a square-shaped FR4 substrate. A metamaterial superstrate is used above the four-port antenna to increase the antenna’s performance characteristics. A 7 × 7 array of rectangular metamaterial unit cells acts as a building block for the metamaterial superstrate to improve impedance matching, enhance isolation between the elements, and boost the antenna’s gain. The metamaterial unit cells are made up of three rectangular rings that are put on top of a 1.6 mm thick FR4 substrate. With a mutual coupling of (>15 dB), the antenna achieved S11 < −10 dB for an impedance bandwidth of 11 GHz. The gain enhancement of up to 1.73 dB is obtained in C and X bands using metamaterial superstrate. The antenna characteristics mainly peak gain, return loss, bandwidth, and isolation are examined. The simulated results affirm a decent deal with experimental results.

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Notes on contributors

Ishita Aggarwal

Ishita Aggarwal received her BTech and MTech degrees from MDU, Rohtak. She has six years of teaching experience in engineering college. Currently, she is pursuing her PhD from Amity University, Noida. She is interested in designing antennas for different applications. She has published five papers at national conferences and one journal paper.

Sujata Pandey

Sujata Pandey has master's in electronics (VLSI) and PhD in electronics from the University of Delhi. Presently, she is working as professor at Amity University UP. She has over 200 research publications in reputed international journals/conferences. Her areas of research are microelectronics, analog/digital VLSI design, and energy harvesting. She is member of IEEE, USA, Member of Electron Device Society, IET UK, Founder Member of VLSI and Semiconductor Society of India, ISTE and Life Member of the Indian Science Congress. Email: [email protected]

Malay Ranjan Tripathy

Malay Ranjan Tripathy is a PhD from the Department of Electronic Science, Delhi University, Delhi, India, since 2000. He worked as a postdoctoral researcher at LPCE, CNRS, Orleans, France, for two years. He worked as organizing member of various IEEE and Scopus indexed conferences in India and abroad. He has delivered invited talks in Ming Chi Technical University, New Taipei, Taiwan, Shenzhen University, China and Chuo University, Tokyo, Japan. He has filed 13 patents and published more than 100 papers in Scopus/SCI indexed conferences and journals. He has worked as visiting scientist at the University of Gavle, Sweden during May–June 2015 and June–July 2016. He is a senior member of IEEE, URSI, IET, CEng (UK), and Life member of ISTE and IETE, India. He is founding chair of joint chapter of IEEE APS and CRFID, Delhi Section. He has received Teaching Excellence 2013 Award, Indo-global Education Summit, New Delhi. He is reviewer of IEEE and other SCI-indexed journals. Present research interest includes antennas, RF designs, circuits, systems, IoT and physical layers. Email: [email protected]

Ashok Mittal

Ashok Mittal presently working as professor and head, Dept of Electronics and Communication Engineering, Ambedkar Institute of Advanced Communication Technologies & Research, Delhi, ESTD 2001 Public University, Govt. of NCT of Delhi (Affiliated to Guru Gobind Singh Indraprastha University, Delhi. India). In the capacity of scientist, worked on the development of various millimeter wave systems, sub-systems and components using hybrid MIC technology and hybrid modular MCM technology (MMIC Multi Chip Modular Technology). Email: [email protected]

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