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Abstract
This paper describes the design aspects of high reliable packages including package resonance, material selection, and feed-through design to match the die designer specifications. Design, simulation and thin film fabrication of 50Ω microstrip line on a 10 mil Al2O3 substrate suitable for MMIC assembly are also presented. Al2O3 substrate is taken because of lower transitional losses at the seal ring of the package, lower leakage and best suitable for hermiticity. Strip line design, study and the input-output transitions between two ports is analysed and optimized. Evidence of package self resonating mode study carried out theoretically and similar is simulated by using CST microwave studio. Package physical model analysis is carried out on a metal-ceramic package (MCP) which is suitable for embedding an amplifier of 20 dB gain and low power in c-band, 35 dB gain and low noise figure in s-band and 28 dB typical gain in x-band. Packaging effects in each case is analysed and optimised to meet the design requirements. With systematic ideas, the complete package modelling, characterization and MMICs packaging are carried out as per the reliability standards for space application. This package is sealed using the hermetic sealing technique to assure no leakage when subjected to the environmental test conditions like operating temperature test, active burn-in test for 240 h and steady-state life test for 1000 h to check MMIC behaviour under overstress conditions. Packaged module RF performances are noted at pre-subjected and post-subjected temperature conditions. Drifts are calculated at both temperature stages.
ACKNOWLEDGEMENT
The authors gratefully express thanks to the package assembly team, RF testing team and QC team for their continuous support during fabrication as well as testing and encouragement during this work. We sincerely thank Shri. A. A. Naik, CEO, GAETEC for supporting this activity to complete.
DISCLOSURE STATEMENT
No potential conflict of interest was reported by the author(s).
Additional information
Notes on contributors
Ravi Gugulothu
Ravi Gugulothu obtained his BTech (ECE) in 2005 and MTech (Embedded Systems) in 2009 from JNTUH affiliated colleges CJITS and AEC, Telangana, India. He is currently engaged in RF measurements and quality control. His research interests and activities are in the field of MMIC interconnects, package, modelling, reliability studies, MCM packaging, system-in-package and system-on-chip.
Sangam Bhalke
Sangam Bhalke obtained his BE (Electronics) from Dr Babasaheb Ambedkar Marathwada University, Aurangabad, India in 1998 and ME (Microwave and Radar Engineering) from University College of Engineering, Osmania University, Hyderabad, Telangana in the year 2020. He is currently engaged in the packaging of microwave and millimetre wave MMICs.Email: [email protected]
Lalkishore K
Kondepudi Lal Kishore, the former Vice-Chancellor of JNTUA, Ananthapur during 2012-15, is a distinguished academician and administrator with over 38 years of teaching experience. A postgraduate and PhD degree holder from IISc, Bangalore, Professor Kishore began his career in teaching at Jawaharlal Nehru Technological University (JNTUH) Hyderabad in 1977. He has over 212 research publications to his credit now.Email: [email protected]
Ramakrishna Dasari
Dasari Rama Krishna received his BTech (ECE) from Sri Krishna Devaraya University, Ananthapur, Andhra Pradesh, India and obtained his ME and Doctor of Philosophy from Osmania University, Hyderabad, Telangana, India. Presently he is working as a professor in the Department of ECE. He published 25 research papers in international journals/conference proceedings. His research areas of interest include multifunction antennas & antenna systems and microwave & millimetre wave integrated circuits. Email: [email protected]