Simulation of Temperature and Moisture Content Profiles in a Pinus radiata Board during High-Temperature Drying

Abstract

A two-dimensional drying model has been simulated for industrial drying schedules to assess sensitivity of the model parameters. The predicted drying times and rates were similar to the results of experimental data. The influence of wood properties on the predicted drying rate was assessed. It was found that the effects of specific heat capacity and thermal conductivity on predicted overall drying rate of board were small. However, the effect of changes in the diffusion coefficient on drying rate below fiber saturation point (moisture content at 30%) was found to be significant.

Keywords:

• Diffusion
• Drying rate
• Fiber saturation point
• Lumber
• Modeling
• Wood properties

ACKNOWLEDGEMENT

This work has been conducted with funding at Ensis under Wood Products for the Future program, Research for Industry contract from New Zealand Foundation for Research Science and Technology.