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ABSTRACT
Efficient chip cooling has become particularly important with the rapid development of high heat flux electronic chips. In this study, a cooling system for electronic chips using dry ice as the cooling medium is developed. The combination of jet impingement and phase change sublimation was employed to achieve efficient cooling by utilizing the Joule-Thomson effect to generate dry ice. The impact of the ratio of heatsink height to inlet diameter (H/D) and dry ice jet velocity on the heat transfer characteristics of the heatsink is investigated by theoretical calculations and experimental tests. The results showed that the optimal heat transfer coefficient was achieved when H/D was 4, 12.76% to 43.28% higher than other H/D values. The chip temperature could be maintained below 38.69°C, which was 8.79% to 36.62% lower than other H/D values, and the heat flux reached 428.92W/cm2. The chip temperature could be effectively regulated by controlling the dry ice flow rate. Furthermore, a comparison with other cooling methods indicated that the dry ice jet cooling system was more suitable for cooling high heat flux electronic devices. The research findings laid the foundation for dry ice cooling of high heat flux chips.
Disclosure statement
The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
Nomenclature
| = | Area, m2 | |
| = | feature length, m | |
| = | jet diameter, m | |
| = | latent heat of vaporization, kJ/kg | |
| = | heat transfer coefficient, W/m2·K | |
| = | specific enthalpy, kJ/kg | |
| = | gravity constant, m/s2 | |
| = | mass flow rate, kg/s | |
| = | heat flux, W/m2 | |
| = | Temperature,°C | |
| = | Velocity, m/s | |
| = | Thermal conductivity, W/m·K | |
| = | Joule-Thomson coefficient, K/Pa | |
| = | Density, kg/m | |
| Subscripts | = | |
| = | Point 1 | |
| = | Point 2 | |
| = | Point 3 | |
| = | dry ice | |
| = | Chip surface | |
| = | Dry ice particles | |
| = | heatsink | |
| = | Joule-Thomson effect | |
| = | experiment | |
| = | outlet | |
| = | inlet | |
| = | Temperature measurement point | |
| = | Temperature measurement point |
Abbreviations
| CPU | = | central processing unit |
| TDP | = | Thermal Design Power |
| HF | = | Heat flux |
| PTFE | = | Poly tetra fluoroethylene |
| = | Mass Flow Rate | |
| = | Nusselt number | |
| = | Reynolds number | |
| = | Prandtl number |