Monte Carlo Simulation of Thin Film Growth with Defect Formation: Application to Via Filling

Abstract

The filling process of via holes in damascene electroplating is investigated with the use of kinetic Monte Carlo method. As a model for damascene plating, we included additives in the Solid-by-Solid model which we developed to study the correlation between the surface and void structures during the crystal growth. Two kinds of additives, inhibitors and accelerators, are taken into account to control the local growth rate and to find out the condition for avoiding the void formation during the filling. A series of simulations have been performed by changing the parameters which characterize the additives to see their influence on the filling mechanism. The distribution of additives, the correlation with the resulting surface and void structures are discussed.

Keywords:

• Monte Carlo method
• Damascene plating
• Via filling
• Additive