Discussion of “Modeling and monitoring methods for spatial and image data”

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Notes on contributors

Yacov Malinovich

Yacov Malinovich is a physicist with expertise in 3D Printing and Electro-Optics. He has more than thirty years of experience in R&D management and technology leadership. Yacov is a Co-Founder at Haifa 3D, a technological community center of volunteers, where he is leading the activities and supporting volunteers to give the world a “Helping Hand!” Dr. Malinovich received his Ph.D. in Physical Chemistry from the Hebrew University of Jerusalem and was awarded Summa Cum Laude for his research. He has served as a guest Lecturer in the Faculty of Mechanical Engineering at the Technion-Israel Institute of Technology for several years and has also been an instructor in the Physical Chemistry Department at the Hebrew University. His scientific and industrial expertise includes a broad background in lasers, microelectronics, imaging, electro-optics, medical and industrial applications of lasers and imagers. He has managerial experience in both large technology companies such as GE Healthcare, Camtek, Tower Semiconductor, Orbotech, and Lumenis and in cutting edge start-ups in Three Dimensional Imaging and in electro-optics.

David M. Steinberg

David M. Steinberg is Professor of Statistics in the Department of Statistics and Operations Research at Tel Aviv University. He has published more than 120 papers in refereed journals along with several book chapters and about 15 papers in conference proceedings. His field of research specialization is the statistical design of experiments including factorial experiments, Latin hypercubes, computer experiments, robust parameter design experiments and seismic networks. He has worked on numerous applications in a variety of fields. In 2013 he received the George Box Medal from the European Network for Business and Industrial Statistics (ENBIS). In 2017 he was awarded the Walter Shewhart Medal from the American Society for Quality. From 2008-2010, he served as Editor of the leading journal Technometrics.