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Abstract
Due to their subwavelength thickness, light weight and easy fabrication, metasurfaces show obvious advantages over 3D metamaterials. Among this, a new concept so-called digital coding metasurfaces which are described in a direct manner by quantized reflection or refraction phases was proposed. This paper proposes a scheme to achieve simultaneous and independent control of phase and amplitude responses via a reflective coding metasurface as it would be beneficial for full control of propagation of electromagnetic waves. The deflection of the reflected beam is dominated by designed coding patterns of digital unit cells while the amplitude adjustment depends on tuning values of loaded resistances on the unit cells. The simulation and experimental results confirm the function of the metasurface proposed above. The independent control of both phase and amplitude profiles of EM waves implies the potential application in beam shaping and high-quality holography.
Acknowledgements
The authors are grateful to other members of the lab for proofreading this manuscript.
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No potential competing interest was reported by the authors.
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Notes on contributors
Shiyun Zhou
Shiyun Zhou received the B.S. degree in Electromagnetic Field and Wireless Technology from the University of University of Electronic Science and Technology of China, Chengdu, China, in 2016. She is recently working toward the Ph.D. degree in electronics science and technology from Zhejiang University, Hangzhou, China. Her current research interests focus on metameterial, metasurface, and EMC/EMI design in the communication system and chip.
Tianwu Li
Tianwu Li received the B.S. degree in Communication Engineering from School of Mechanical, Electrical & Information Engineering, Shandong University, Weihai, China, in 2016, and is currently working towards the Ph.D. degree in Electronics Science and Technology from Zhejiang University, Hangzhou, China. His current research interests focus on frequency selective surface, metamaterial, metasurface and EMC/EMI design in communication system and chip.
Erping Li
Erping Li (S’91, M’92, SM’01, F’08) received the Ph.D. degree in electrical engineering from Sheffield Hallam University, Sheffield, U.K., in 1992. He is currently a Changjiang-Qianren Distinguished Professor, Department of Information Science and Electronic Engineering, Zhejiang University, China; Dean of Joint Institute of Zhejiang University-University of Illinois at Urbana-Champaign. Since 1989, he has served as a Research Fellow, Principal Research Engineer, Associate Professor and the Technical Director at the Singapore Research Institute and University. In 2000, he joined the Singapore A*STAR Research Institute of High Performance Computing as a Principal Scientist and Director. His research interests include electrical modeling and design of micro/nano-scale integrated circuits, 3D electronic package integration and nano-plasmonic technology. Dr Li is a Fellow of IEEE, and a Fellow of MIT Electromagnetics Academy, USA. He is the recipient of 2015 IEEE Richard Stoddard Award on EMC, IEEE EMC Technical Achievement Award, Singapore IES Prestigious Engineering Achievement Award, and Changjiang Chair Professorship Award from the Ministry of Education in China, and number of Best Paper Awards. He was elected to the IEEE EMC Distinguished Lecturer in 2007. He served as an Associate Editor for the IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS from 2006–2008 and served Guest Editor for 2006 and 2010 IEEE TRANSACTIONS on EMC Special Issues, Guest Editor for 2010 IEEE TRANSACTIONS on MTT APMC Special Issue. He is currently an Associate Editor for the IEEE TRANSACTIONS ON EMC and IEEE TRANSACTIONS on CPMT. He is the Founding Member of IEEE MTT-RF Nanotechnology Committee. He has been a General Chair and Technical Chair, for many international conferences. He was the President for 2006 International Zurich Symposium on EMC, the Founding General Chair for Asia-Pacific EMC Symposium, General Chair for 2008, 2010, 2012, 2016 APEMC, and 2010 IEEE Symposium on Electrical Design for Advanced Packaging Systems. He has been invited to give numerous invited talks and plenary speeches at various international conferences and forums.