Evolution of viscoelastic behaviour of a curing LY5052 epoxy resin in the rubbery state

Abstract

In this work, we investigate the relationship between the rubbery modulus and the degree of cure for partially to fully cured LY5052 epoxy resin. In particular, this paper experimentally tests an existing model formulated for shear modulus by redefining for in the tensile storage modulus. Experiments to characterize viscoelastic behaviour were performed in a dynamic mechanical and thermal analysis (DMTA) instrument in the frequency domain. Master curves are then created from DMTA using general time–temperature–cure superposition. The master curves are then normalized using the model so that the master curve does not depend on the properties in the rubbery region. This results in a unique master curve that describes the viscoelastic behaviour of the LY5052 epoxy resin for the given conditions. Once the relationship between the rubbery modulus and the degree of cure has been established, the amount of experimental characterization can be reduced. This could lead to the development of simplified experimental methodologies and simplified models to characterize the viscoelasticity of low molecular weight resins like the LY5052 epoxy resin system.

Keywords:

• thermosetting resin
• curing
• mechanical properties
• thermal analysis

Acknowledgements

This work was supported by the SICOMP Foundation, the Swedish Research Council (VR) under the Grant 621-2008-5943 and by the strategic innovation programme LIGHTer supported by VINNOVA under the Grant 2014-06041.