Abstract
Negative luminescent (NL) devices, which to an IR observer appear colder than they actually are, have a wide range of possible applications, including use as thermal radiation shields in IR cameras, and as IR sources in gas-sensing systems. For many of these applications a large area (>1 cm2) device which displays as large as possible apparent temperature range is required. However, under reverse bias, significant currents are required to reduce the carrier concentrations to the levels needed for maximum possible absorption. We have therefore used a novel micromachining technique to fabricate integrated optical concentrators in InSb/InAlSb and HgCdTe NL devices. Smaller area diodes can then be used to achieve the same absorption (e.g. for InSb an area reduction of 16 is possible) and the required currents are thus reduced. To fabricate the concentrators, spherical resist masks are first produced, which are ∼10 μm high and ∼53 μm wide, by resist reflow at 120°C. Inductively coupled plasma (ICP) etching is then used to etch alternately the resist mask and the semiconductor, with oxygen and methane/hydrogen respectively, producing concentrators with almost parabolic profiles. Currently, the concentrators are typically 30 μm high, with a top diameter of ∼15 μm. Continuing optimization of the process to reach the theoretical limits of optical gain is described.