Stresses and strains in soldered joints

Abstract

In this article, current thinking on stresses in soldered joints of different physical and mechanical properties was appraised, as well as the possibilities for decreasing them with the use of different techniques, from technological experiments to numerical methods. The influence of individual factors on the size of stresses was analysed, including the solder gap size, the thicknesses of joined elements, area and soldered surface roughness, spacers, and compensation inserts as well as joint geometry. The results of numerical calculations of 2D models of soldered joints for different sizes of surfaces soldered at a constant width of solder gap were also presented. Particular attention was paid to stresses occurring in joints with large soldering surfaces.

Acknowledgements

The authors would like to thank the Ministry of Science and Higher Education for funding, Ministry of Science and Higher Education (MNiSW) Research Project No. N N507 356635, entitled ‘The influence of the soldered joint's geometry of large surface sintered cermets with precipitation hardened steel on their microstructure and the state of their stresses and strains’. This article was prepared as part of an MNiSW Research Project.