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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 53, 2008 - Issue 11
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Original Articles

Optimizing Thermomagnetic Convection for Electronics Cooling

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Pages 1231-1255 | Received 15 Sep 2007, Accepted 21 Nov 2007, Published online: 04 Feb 2008
 

Abstract

The present work reports steady-state simulation of thermomagnetic convection in a square cavity filled with magnetic fluid. Two symmetrically placed, discrete, constant-flux, flush-mounted heaters on the bottom wall represent power-dissipating devices in microelectronics applications. The side walls are isothermal heat sinks. Convection is established by placing a line dipole below the bottom wall. Heat transfer and flow patterns are studied under different length and/or strength ratios of the heaters while the total heat supplied remains constant. The computational study helps determine the range in which the heater sizes and/or flux strengths may be varied so that the devices operate within “safe” temperature limits.

This work was partially supported by the Centre for Nano Science and Technology, Jadavpur University, under the UGC Scheme of University with Potential for Excellence. We acknowledge the Council of Scientific and Industrial Research (CSIR), Government of India, for the financial support provided to the first author.

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