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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 54, 2008 - Issue 10
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Original Articles

Estimation of the Transient Heat Transfer Rate at the Boundary of an Electronic Chip Packaging

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Pages 945-961 | Received 29 Jul 2008, Accepted 03 Sep 2008, Published online: 28 Oct 2008
 

Abstract

In this study, an inverse algorithm based on the conjugate gradient method and the discrepancy principle is applied to estimate the unknown time-dependent heat transfer rate at the electronic-packaging/heat-sink-assembly interface from the knowledge of temperature measurements taken within the packaging. The temperature data obtained from the direct problem are used to simulate the temperature measurements, and the effect of the errors in these measurements upon the precision of the estimated results is also considered. Results show that an excellent estimation on the time-dependent heat transfer rate can be obtained for the test case considered here.

This work was supported by the National Science Council, Taiwan, Republic of China, under the grant numbers NSC 95-2221-E-168-025 and NSC 95-2221-E-168-033.

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