Investigating the Boiling and Transition Zones and the Rewetting Process of a Substrate Plate during Submerged Liquid Jet Cooling

Abstract

A numerical model is developed to simulate the flow field, as well as the conjugate heat transfer process, during transient cooling of a flat substrate plate cooled by a single submerged impinging water jet. At wall temperatures above the liquid boiling point, the vapor formation process in different boiling regimes and the interaction of the vapor phase with the developing jet-flow field are addressed in the model. The developing submerged jet flow, the conjugate heat transfer from a flat substrate plate and the resulting temperature distribution inside the plate are simulated with respect to the transient boiling phase distribution. The influence of the liquid subcooling temperature (40 K ≤ T _sub  ≤ 80 K), the plate thickness (0.5 ≤ h/d ≤ 15), the conductivity of the solid substrate material (18 W/(m K) ≤ λ _solid  ≤ 380 W/(m K)) on the transition region positions (e.g., the Leidenfrost point), and the transition temperatures are analyzed.