Optimization analysis of multi-layered microchannel heat sink

Abstract

Microchannel heat sinks with a large specific surface area are widely applied to the heat dissipation of microelectronic devices. In this work, a multi-layered microchannel heat sink with a size of $100\mathrm{ }\mathrm{\text{mm}}\times 50\mathrm{ }\mathrm{\text{mm}}$ was proposed based on the microchannel of the Printed Circuit Heat Exchanger (PCHE). The thermal resistance network model was established for the multi-layered heat sink with a semi-circular cross-section microchannel. Then, the Genetic Algorithm(GA) was employed to optimize the structure and operation parameters of the heat sink based on the thermal resistance network model. The optimized parameters and the corresponding thermal resistance under various power consumption were obtained. The optimization results show that the thermal resistance decreases rapidly with the increase of power consumption. When the power consumption is large, the trend of thermal resistance reduction is gradually flat. When the power consumption increases to 0.8 W, the optimal value of channel layers is up to 12, and the thermal resistance of the heat sink is 0.322 °C/(W/cm²). As the power consumption further increases from 0.8 W, the optimal value of layers remains constant at 12, and the ratio of the channel radius to the plate thickness remains at about 0.56. Three-dimensional numerical simulation is performed to verify the thermal resistance network model, and the results of the thermal network model agree well with the simulation.

Keywords:

• Multi-layered microchannel heat sink
• numerical simulation
• optimization
• semi-circular cross-section channel
• thermal resistance network model

Disclosure statement

No potential conflict of interest was reported by the author(s).

Additional information

Funding

This work was supported by the National Key R&D Program of The People’s Republic of China [2018YFB0104502].