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Materials and Manufacturing Processes Volume 28, 2012 - Issue 1
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Preparation of High-Performance Conductive Ink with Silver Nanoparticles and Nanoplates for Fabricating Conductive Films

Xiaojian Yang State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan, ChinaCorrespondence[email protected]
,
Wei He State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan, China
,
Shouxu Wang State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan, China
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Guoyun Zhou State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan, China
&
Yao Tang State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan, China
Pages 1-4 | Received 31 Mar 2012, Accepted 13 Jun 2012, Published online: 10 Jan 2013
 
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Abstract

A novel preparation method for a high-performance conductive ink which consisted of silver nanoplates, spherical silver nanoparticles, and epoxy resin was developed. Silver nanoparticles and nanoplates were synthesized via chemical reduction method in the presence of poly (vinyl pyrrolidone) (PVP). The prepared silver ink exhibited a remarkable electrical, thermal stability, and mechanical properties, which were confirmed by the four-point probe method, thermogravimetric analysis (TGA), and the three-point bending testing. We demonstrated the influence of sintering temperatures and time on the electrical resistivity. After sintering at 150°C for 15 min, the conductive film was able to achieve the volume electrical resistivity of (3–4) × 10−5Ω · cm.

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