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Abstract
Diffusion bonding of commercially available pure aluminum/copper was carried out between the temperatures of 400°C and 500°C for 60 min under the pressure of 5–15 MPa in vacuum. The effects of temperature and pressure on the microstructure of aluminum/copper diffusion bonded joints were analyzed. The interface micrographs of the bonded samples were observed in optical and scanning electron microscope (SEM) images. The soundness of the bond was evaluated by destructive and nondestructive (ultrasonic C scan) testing methods. The quality of the bonded joints was evaluated by the intensity of the echo and its images of ultrasonic testing and was correlated with destructive parameters such as the strength ratio. Chemical compositions of the interface and the fractured surface of the bonded samples were characterized by energy dispersive spectroscopy (EDS). EDS patterns were confirmed by the formation of the different compositions at the interface of the bonded samples. Better bonding characteristics were observed by diffusion bonding optimum parameters at 450°C with an applied pressure of 15 MPa for 60 min.