Hybrid micro-grinding process for manufacturing meso/micro-structures on monocrystalline silicon

ABSTRACT

The recent paper proposes a hybrid micro-grinding process for ultra-precision meso/micro components of monocrystalline silicon manufacturing. The proposed technique utilizes the chemical modification solution to modify and soften the surface layer and then manufactures meso/micro-structures via micro-grinding. A special chemical solution with optimized formula was prepared, and a 0.31 mm diameter, CVD diamond micro-grinding tool is hired to perform the micro-grinding action at 100,000 rpm of spindle speed, 0.2 mm/min of feed rate, and a machining depth of 10 µm. The results show that the proposed hybrid micro-grinding process achieves a superior machining quality compared with the conventional micro-grinding process. Moreover, the micro-grinding tool used in the proposed grinding strategy has far smaller tool wear than the conventional process.

KEYWORDS:

• Modification
• silicon
• grinding
• slot
• manufacturing
• micro
• ultra-precision
• tool
• wear

Acknowledgments

The authors acknowledge the college of mechanical and vehicle engineering school for the technical support. The authors also would like to appreciate the Chinese National Science Foundation and Central Universities Fundamental Research Funds for their financial support.

Additional information

Funding

The presented work was funded by the National Natural Science Foundation of China (51875192, 51675170) and the Fundamental Research Funds for the Central Universities (531118010341).