Abstract
In this paper, we investigated the feasibility of cerium oxide (CeO2) films as buffers layer of MFIS (metal ferroelectric insulator semiconductor) type capacitors. CeO2 layer were prepared by a two-step process of a low temperature film growth and subsequent RTA (rapid thermal annealing) treatment. By applying a cerium (Ce) metal seed layer of 4 nm, unwanted SiO2 layer generation was successfully suppressed at the interface between the buffer layer and the Si substrate. After N2 plasma treatment, the leakage current was reduced by about 2-orders. By employing a N2 plasma treatment, we were able to successfully obtain good properties at the interface between the buffer layer and the Si substrate.
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ACKNOWLEDGMENTS
This work was supported by Korea Industrial Technology Foundation.