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Integrated Ferroelectrics
An International Journal
Volume 66, 2004 - Issue 1
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Original Articles

Microstrip Band Pass Filter of GHz Region Employing Aerosol-Deposited Alumina Thick Films

SONG-MIN NAM Department of Metallurgy and Ceramics Science Graduate School of Science and Engineering Tokyo Institute of Technology, Tokyo, Japan, 152-8552
,
MIHOKO MOMOTANI Department of Metallurgy and Ceramics Science Graduate School of Science and Engineering Tokyo Institute of Technology, Tokyo, Japan, 152-8552
,
NAOKO MORI Department of Metallurgy and Ceramics Science Graduate School of Science and Engineering Tokyo Institute of Technology, Tokyo, Japan, 152-8552
,
HIROFUMI KAKEMOTO Department of Metallurgy and Ceramics Science Graduate School of Science and Engineering Tokyo Institute of Technology, Tokyo, Japan, 152-8552
,
SATOSHI WADA Department of Metallurgy and Ceramics Science Graduate School of Science and Engineering Tokyo Institute of Technology, Tokyo, Japan, 152-8552
,
JUN AKEDO National Institute of Advanced Industrial Science and Technology (AIST), Ibaraki, 305-8564
&
TAKAAKI TSURUMI Department of Metallurgy and Ceramics Science Graduate School of Science and Engineering Tokyo Institute of Technology, Tokyo, Japan, 152-8552
 show all
Pages 301-310 | Received 01 May 2004, Accepted 01 May 2004, Published online: 12 Aug 2010
 
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Abstract

The miniaturized 10 GHz microstrip band-pass filter was successfully fabricated on the alumina thick films grown on Cu substrates at room temperature by aerosol deposition method and using the newly developed pattern electroplating procedure and electromagnetic analysis. The relative dielectric permittivity and loss tangent of the aerosol-deposited alumina thick films on Cu were 9.9 and 0.089, respectively. The resistivity of the electroplated Cu line was determined to be 2 × 10− 8 Ω m. The very good agreement was shown between results simulated using a 3-dimensional electromagnetic analysis and the actual measured data.

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