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ABSTRACT
Complicate shaped multilayer ceramic devices, especially piezoelectric actuated devices, are difficult to be produced due to non-easy fabrication processes such as such as cutting, lamination, and co-firing. These issues related to the fabrication can be solved through a specially designed bonding method of green body joining, which offers several advantages such as high density, structural matches to matrix materials, and improvement of mechanical properties owing to similar shrinkage rate with matrix materials. In this study, the bonding procedure and electrical properties of piezoelectric actuators fabricated by green body joining method with ceramic slurry is reported. While electric properties of actuators with interlayer (green body/ceramic slurry) displayed similar electric properties to those of actuators without the interlayer, actuators bonded by epoxy showed electrical properties different than those of actuators with and without the interlayer. By employing a binder with similar composition to that of the matrix material, the piezoelectric and dielectric properties of the interlayer have been improved after the sintering process.
ACKNOWLEDGMENTS
This research was supported by a grant from the Center for Advanced Materials Processing (CAMP) of the 21st Century Frontier R&D Program funded by the Ministry of Science and Technology, Republic of Korea.