ABSTRACT
Polymeric poly (vinylidene fluoride) (PVDF) films which could be available for the piezoelectric and pyroelectric applications were prepared by ultrasonic atomization method. During the ultrasonic atomization processing, the mist of the PVDF-DMA solution source was generated with an ultrasonic atomizer at the frequency of 6 MHz and carried onto the substrates using air as carrier gas at the pressure of 1 atm. The PVDF films were characterized by X-ray diffraction (XRD) and atomic force microscope (AFM). Investigations including piezoelectric coefficient measurements showed that poled PVDF films had strong piezoelectric properties. As a result, ultrasonic atomization is very effective for preparation of PVDF films, and the piezoelectric coefficient of the sample is about 28 pC/N.
ACKNOWLEDGMENTS
The authors gratefully acknowledge the financial fund supported by National Science Fund of China Distinguished Young Scholars, No. 60425101.