Low Dielectric Thermoset from Redistributed Poly(phenylene oxide)

Abstract

A curable low-molecular-weight poly(phenylene oxide) (PPO) was prepared by the redistribution of regular PPO with bisphenol-A (BPA) followed by etherification of the redistributed-PPO (BPA-PPO) with N,N-diallyl-2-chloroacetamide. The redistributed-PPO with allyl group (AL-PPO) was characterized by proton nuclear magnetic resonance, and Fourier transform infrared spectroscopy. The AL-PPO oligomers with reactive double bounds were cured with triallylisocyanurate (TAIC) and/or phosphorus-containing allyl-functionalized monomer (allyl-DOPO). The glass transition temperatures were measured by dynamic mechanical analysis (DMA). Electrical properties of cured resins were studied using dielectric analyzer (DEA). The flame retardancy was determined by a UL-94 vertical test. The effects of curing accelerator, amount of TAIC and allyl-DOPO incorporated into the network on the glass transition temperatures, dielectric properties, and flame retardancy of the resulting systems were investigated. The results indicated that AL-PPO cured with TAIC exhibited high glass-transition temperature (162–198°C), low dielectric constants (2.36–2.57 at 1 GHz) and dissipation factors (0.0039–0.0043 at 1 GHz). The AL-PPO/TAIC copolymerized with allyl-DOPO could achieve a flame retardancy rating of UL-94 V-0 at about 1.35% phosphorus content. The AL-PPO/TAIC resins have potential applications in the fabrication of printed circuit board.

Keywords:

• Poly(phenylene oxide)
• curing of polymers
• thermosets
• dielectric properties
• Thermal properties