Abstract
A novel approach was developed to improve the solubility of non-soluble compounds by introducing solubilising molecules peripherally through hydrogen-bond-mediated assembly. The solubilisation process can be reversed by adding competing hydrogen bonding moieties and removing the solubilising molecules. This method may potentially facilitate device fabrication.
Acknowledgements
The authors are grateful to the National Basic Research Program (2007CB808000) from the Ministry of Science and Technology and National Natural Science Foundation of China (No. 20544004, 50873002 and 21074004).