This article refers to:
Annuar S, Mahmoodian R, Hamdi M, et al. Intermetallic compounds in 3D integrated circuits technology: a brief review. Sci Tech Adv Mater. 2017;18(1):693—703. https://doi.org/10.1080/14686996.2017.1364975
When the above article was published, affiliation c for author K-N Tu was incorrectly given as Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, People’s Republic of China. The correct affiliation is Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, ROC.
Taylor & Francis apologises for this error.