Temperature effect on elastic modulus of thin films and nanocrystals

Abstract

The stability of nanoscale devices is directly related to elasticity and the effect of temperature on the elasticity of thin films and nanocrystals. The elastic instability induced by rising temperature will cause the failure of integrated circuits and other microelectronic devices in service. The temperature effect on the elastic modulus of thin films and nanocrystals is unclear although the temperature dependence of the modulus of bulk materials has been studied for over half a century. In this paper, a theoretical model of the temperature-dependent elastic modulus of thin films and nanocrystals is developed based on the physical definition of the modulus by considering the size effect of the related cohesive energy and the thermal expansion coefficient. Moreover, the temperature effect on the modulus of Cu thin films is simulated by the molecular dynamics method. The results indicate that the elastic modulus decreases with increasing temperature and the rate of the modulus decrease increases with reducing thickness of thin films. The theoretical predictions based on the model are consistent with the results of computational simulations, semi-continuum calculations and the experimental measurements for Cu, Si thin films and Pd nanocrystals.

Keywords:

• cohesive energy
• nanocrystals
• thermal expansion
• size effect
• vibration entropy

Acknowledgements

This work was supported by the National Basic Research Program of China (2012CB937500), the National Natural Science Foundation of China (10802088, 10832008, 11023001, 11021262, 10932011 and 91116003), and the Opening Fund of LNM.