Finite element modeling and analysis of adhesive layer effects in surface-bonded piezoelectric sensors and actuators including non-uniform thickness

Abstract

A finite element model for multi-functional structures containing surface-bonded piezoelectric patches is proposed with two main objectives: to reduce the computational cost of detailed and accurate analyses; and to fully account for the adhesive layer between structure and patches, including non-uniform thickness. The proposed model is verified and used to assess the effect of adhesive layer properties on the performance of piezoelectric sensors and actuators, based on frequency responses and effective electromechanical coupling coefficient. Results indicate that increases of bonding layer thickness and thickness non-uniformity are not always detrimental to the actuation/sensing performance and could be explored as design parameters.

Keywords:

• Adhesive layer
• bonding layer
• electromechanical coupling coefficient
• finite element model
• piezoelectric materials
• smart structures

Acknowledgments

Support of the National Council for Scientific and Technological Development (CNPq), grants 309193/2014-1 and 309001/2018-8, is acknowledged.