Scattering of SH waves in a bi-material half space with a circular hole and periodic type III interfacial cracks

Abstract

The dynamic anti-plane response of a bi-material half space including a circular hole and periodic interfacial cracks is investigated. An analytical model is established for periodic type III cracks that adopt the idea of “conjunction” modeling. The definite integral equations suitable for modeling the existence of multiple interfacial cracks are derived that satisfy the continuity conditions at the interface. Numerical calculations are carried out to find the dynamic stress concentration factor (DSCF), whose results indicate that the number of interfacial cracks has a significant effect on the dynamic stress concentration around the hole edge, especially for low-frequency incident SH waves.

Keywords:

• SH waves
• circular hole
• periodic cracks
• dynamic stress concentration factor (DSCF)
• complex function

Additional information

Funding

The project was supported by the Youth Fund of National Natural Science Foundation of China (Project No. 12002198), Error! Hyperlink reference not valid. (Project No. 20YF1414500), and National Natural Science Foundation of China.