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Mechanics of Advanced Materials and Structures Volume 31, 2024 - Issue 15
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Original Articles

Interface evolution behavior of Si-based adhesive structures under tensile loading based on terahertz time-domain spectroscopy

Yi-Fan Zhonga School of Optoelectronics Engineering, Changchun University of Science and Technology, Changchun, PR China;b Key Laboratory of Optoelectronic Measurement and Control and Optical Information Transmission Technology, Ministry of Education, School of Optoelectronic Engineering, Changchun University of Science and Technology, Changchun, PR China;c Zhongshan Research Institute, Changchun University of Science and Technology, Zhongshan, PR ChinaORCID Iconhttps://orcid.org/0000-0001-9240-5918View further author information
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Li-Juan Lia School of Optoelectronics Engineering, Changchun University of Science and Technology, Changchun, PR China;b Key Laboratory of Optoelectronic Measurement and Control and Optical Information Transmission Technology, Ministry of Education, School of Optoelectronic Engineering, Changchun University of Science and Technology, Changchun, PR China;c Zhongshan Research Institute, Changchun University of Science and Technology, Zhongshan, PR ChinaCorrespondence[email protected]
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Jiao-Jiao Rena School of Optoelectronics Engineering, Changchun University of Science and Technology, Changchun, PR China;b Key Laboratory of Optoelectronic Measurement and Control and Optical Information Transmission Technology, Ministry of Education, School of Optoelectronic Engineering, Changchun University of Science and Technology, Changchun, PR China;c Zhongshan Research Institute, Changchun University of Science and Technology, Zhongshan, PR ChinaView further author information
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Ji-Yang Zhanga School of Optoelectronics Engineering, Changchun University of Science and Technology, Changchun, PR China;b Key Laboratory of Optoelectronic Measurement and Control and Optical Information Transmission Technology, Ministry of Education, School of Optoelectronic Engineering, Changchun University of Science and Technology, Changchun, PR China;c Zhongshan Research Institute, Changchun University of Science and Technology, Zhongshan, PR ChinaView further author information
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Dan-Dan Zhanga School of Optoelectronics Engineering, Changchun University of Science and Technology, Changchun, PR China;b Key Laboratory of Optoelectronic Measurement and Control and Optical Information Transmission Technology, Ministry of Education, School of Optoelectronic Engineering, Changchun University of Science and Technology, Changchun, PR China;c Zhongshan Research Institute, Changchun University of Science and Technology, Zhongshan, PR ChinaView further author information
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Jian Gua School of Optoelectronics Engineering, Changchun University of Science and Technology, Changchun, PR China;b Key Laboratory of Optoelectronic Measurement and Control and Optical Information Transmission Technology, Ministry of Education, School of Optoelectronic Engineering, Changchun University of Science and Technology, Changchun, PR China;c Zhongshan Research Institute, Changchun University of Science and Technology, Zhongshan, PR ChinaView further author information
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Jun-Wen Xuea School of Optoelectronics Engineering, Changchun University of Science and Technology, Changchun, PR China;b Key Laboratory of Optoelectronic Measurement and Control and Optical Information Transmission Technology, Ministry of Education, School of Optoelectronic Engineering, Changchun University of Science and Technology, Changchun, PR China;c Zhongshan Research Institute, Changchun University of Science and Technology, Zhongshan, PR ChinaView further author information
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Qi Chenc Zhongshan Research Institute, Changchun University of Science and Technology, Zhongshan, PR ChinaView further author information
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Pages 3185-3194 | Received 23 Sep 2022, Accepted 16 Jan 2023, Published online: 31 Jan 2023
 
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Abstract

The thickness of the bonding interface changes after the structure has been subjected to tensile load, thereby affecting the strength of the bonding structure. It is necessary to monitor the evolution of the bonding interface thickness under tensile load. Through terahertz time-domain spectroscopy imaging and scale-invariant feature transform image processing, the thickness variation of three interfaces of 150 silicon-based adhesive structures under tensile load were analyzed. It was determined that variation at the edge was larger than that in the middle area. The research results also provide data support for the bonding structure health monitoring systems.

Acknowledgments

We would like to thank Changchun University of Science and Technology for the use of their equipment.

Additional information

Funding

This research was supported by the Jilin Province Science and Technology Development Plan Project with grant No. 20220508032RC, as well as the second batch of social welfare and basic research projects in Zhongshan with grant No. 2022B2012.

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