Chip-On-Glass Bonding Using Sn Bump and Non-Conductive Adhesive for LCD Application

Abstract

We developed a new chip-on-glass (COG) bonding method using non-conductive adhesive (NCA) and Sn bumps. The bonding was performed with various electrode pads on the glass substrate at 150°C for 150 s under 100 MPa. The initial average contact resistance was 5.7 mΩ for Au pad, 19.6 mΩ for indium-tin oxide (ITO)/Au pad, 11.2 mΩ for Al pad respectively. Thermal cycling test was performed in the temperature range between 0°C and 100°C. The contact resistance of the Sn bump-Au pad joints did not change even after 1000 cycles. In contrast, the joints formed on other type of pads failed electrically between 300 and 500 cycles.

Keywords:

• chip-on-glass (COG)
• non-conductive adhesive (NCA)
• Sn bump
• thermal cycling

Acknowledgments

This work was supported by the Korea Research Foundation Grant (KRF-2004-005-D00164).