Formation of Circuit Pattern on Liquid-Crystalline Polymer Film by Electroless Copper Plating

Abstract

Liquid-crystalline polymer (LCP) films were treated with N₂ plasma in order to improve adhesion with metal film. By N₂ plasma treatment, hydrophilic groups such as NH, COOH and OH were introduced into LCP film and the surface of the film was roughened slightly. After N₂ plasma treatment, a copper film was deposited on the LCP by electroless plating method. The circuit pattern of copper film with 0.5 mm (line) and 0.3 mm (space) intervals was fabricated on the LCP film.

Keywords:

• circuit pattern
• electroless copper plating
• liquid-crystalline polymer (LCP)
• plasma treatment

Acknowledgments

This work was partially supported by a Grant-in-Aid for Scientific Research (16360040 and 17656031) and by the Photonics Materials Laboratory Project of the VBL of the Graduate School of Science and Technology, Kobe University.