Cathode Unit of Magnetron Sputter for High Target Utilization

Abstract

Magnetron sputtering has become one of most useful methods for depositing thin films. However this coating technique has low target utilization and target life time. In this paper a new cathode unit was designed and tested with the simulation of magnetic field to extend the life time of target. The Cu target utilization was increased up to 45% compared to the conventional sputtering cathode. The thickness variation of thin films deposited was also improved in this method. Discharge property, thin films thickness and erosion depth were measured for the whole life time of target. These results were compared with the data obtained with a conventional cathode unit used in the magnetron sputter.

Keywords:

• erosion profile
• magnetic circuit
• magnetic field
• magnetron sputtering cathode
• target utilization

Acknowledgments

This work was supported by the Regional Innovation Center Program (ADMRC) of the Ministry of Knowledge Economy and the Small and Medium Business Administration, Republic of Korea.