Overlaying performance and bonding mechanism of wood-based panels decorated by EVA film reinforced decorative wood veneer

ABSTRACT

In order to understand the bonding mechanism of thermoplastic film reinforced wood veneer and broaden its application to wood-based panels, EVA film reinforced decorative wood veneer (EVA-RDV) was prepared and used for decoration of medium density fiberboard (MDF) and plywood (PW) respectively in this study. Decorative veneered wood-based panels were prepared by hot pressing followed by cold pressing, and their surface bonding strength and immersion peel performance were tested. The results showed that both veneered panels prepared in optimized hot-pressing parameters met the requirements of interior materials in GB/T 17657-2013. But due to the different surface properties between MDF and PW, their bonding effect with EVA-RDV was slightly different. Generally, the surface bonding strength of veneered MDF was higher than that of veneered PW, while its immersion peel performance was weaker. When the EVA film thickness was 0.3 mm, the surface bonding strength of veneered MDF and veneered PW was 1.74 and 1.30 MPa, respectively. Due to the low surface roughness of MDF and the existence of a pre-curing layer, cold pressing played a much more important role in the manufacturing process of veneered MDF.

KEYWORDS:

• Decorative wood veneer
• EVA film
• veneered wood-based panels
• surface bonding strength
• immersion peel performance

Acknowledgement

The authors are grateful to the advanced analysis and testing center of Nanjing Forestry University.

Disclosure statement

No potential conflict of interest was reported by the author(s).

Additional information

Funding

This research was funded by the Postgraduate Research & Practice Innovation Program of Jiangsu Province [Grant Number SJCX22_0315]; College Students Innovation and Entrepreneurship Training Program Project of Nanjing Forestry University [Grant Number 2021NFUSPITP0425]; Industry University Cooperation Collaborative Education Project [Grant Number 202101148003].