Adsorption competition of Cu(II) ion in ionic pair and multi-metal solution by ionic imprinted amino-silica hybrid adsorbent

Abstract

It was carried out the synthesis of the Cu(II) ionic imprinted polymer (Cu(II)-IIP) material of amino-silica hybrid via sol-gel process using a tetraethyl-orthosilicate precursor and an active compound 3-aminopropyltrimetoxyslane. Adsorption process of Cu(II) ion on non-imprinted ionic (NIP) material and Cu(II)-IIP follows pseudo-first-order kinetics model with the value of adsorption rate constants (k₁) 0.030 and 0.058 L/min and Langmuir adsorption isotherm with the value of adsorption capacity 29.556 and 71.400 mg/g, respectively. Adsorption competition data in ion pair solution of Cu(II)/Ag(I), Cu(II)/Zn(II), Cu(II)/Ni(II), and Cu(II)/Cd(II) showed that the Cu(II)-IIP adsorbent was more selective than NIP with value of selectivity coefficient (α) > 1. A tendency of metal ion adsorbed in multi-metal solution follows this order: Ca(II) < Cd(II) < Ni(II) < Zn(II) < Ag(I) < Cu(II). The Cu(II)-IIP is stable chemically and it can be reused for adsorption of Cu(II) ion in solution without reduction of its capacity.

Keywords:

• Cu(II) ionic imprinted
• Selective adsorption
• Sol-gel
• Amino-silica hybrid

Acknowledgments

The authors would like to thank to the Directorate of Research and Community Services, Directorate General of Higher Education (DIKTI), Ministry of National Education, Republic of Indonesia, for financial support of this research.