Polysiloxane-graphite composites as thermal interface material for light emitting diode application: a study on impact of graphite nanopowder on thermal and surface properties

ABSTRACT

The thermal and surface properties of pure polysiloxane and graphite nanopowder (10% to 50%) reinforced polysiloxane composite films were studied. Polysiloxane/Graphite (50%-50%) Composite exhibit improved thermal conductivity (k – 0.35 W/mK) and decreased Junction temperature (ΔT_j = 31.29 °C @ 700 mA) and thermal resistance (∆R_th-tot = 14.96 K/W @ 700 mA) compared to pure polysiloxane film. Overall, the prepared composites can be used as an alternate elastomer thermal pad or Thermal Interface Material for efficient thermal management in electronic packaging especially for LED applications.

Graphical abstract

KEYWORDS:

• Polysiloxane
• graphite
• LED
• thermal transient testing
• thermal conductivity
• surface analysis

Acknowledgments

Vishnu Chandar Janakiraman expresses gratitude to USM Fellowship for financial support.

Additional information

Notes on contributors

J. Vishnu Chandar

J. Vishnu Chandar was born in India. He received the B.E.  degree in Electronics and Communication Engineering from Anna University, Chennai, Tamilnadu, India in 2012 and the M.Sc. degree in Physics from School of Physics, Universiti Sains Malaysia (Main Campus), Malaysia, in 2018. He is currently pursuing the Ph.D. degree with Universiti Sains Malaysia, with focus on biodegradable nanocomposites for PCB, heat sink and other electronic packaging applications and development

S. Shanmugan

S. Shanmugan received the bachelor’s degree in chemistry from Bharathidasan University, Tiruchirappalli, India, in 1997, the master’s degree in energy science from Madurai Kamarajar University, Madurai, India, in 2000, and the Ph.D. degree in thin film from Anna University, Chennai, India. His current research interest includes identifying the best thermal interface material in solid state devices in semiconductor industries

D. Mutharasu

D. Mutharasu received the M.Sc. degree in physics, and the M.Phil. and Ph.D. degrees in energy science from Madurai Kamaraj University, Madurai, India, in 1991, 1992, and 2000, respectively. He is currently working as Senior Technologist, Core competency lead, Center for Innovation and Automation (CIA) Lab, in Western Digital Corporation, Malaysia. He has authored/co-authored more than 250 research papers in refereed international journals and conferences. His current research interests include heat transfer in semiconductors and electronic packaging. His current research interests include heat transfer

M. Khairudin

M. Khairudin received M.E. and Ph.D. degrees in engineering (nanotechnology) from the University of Canterbury, Christchurch, New Zealand, in 2005 and 2009, respectively. He has been serving the School of Mechanical Engineering, Universiti Sains Malaysia Engineering Campus, Penang, Malaysia, as academic staff since 2010. His current research interests include nanofabrication of top down and bottom up techniques, and the fabrication of 3-D nanostructures for nanodevices application.

A. A. Azlan

A. A. Azlan graduated with MSc and PhD from University of Manchester Institute of Science and Technology (UMIST), United Kingdom. He is now a Professor in Nanomaterials and Nanostructures at School of Physics, Universiti Sains Malaysia (USM). Since 1992, he has been actively engaged in the research field of solid-state physics and materials science; in particular, amorphous and nanostructure materials designed for sensors application. He is currently one of the lead researchers at Nano-Optoelectronics Research and Technology Laboratory (N.O.R Lab) and as one of the principle researchers of Nano Biotechnology Research and Innovation (NanoBRI@INFORMM) team at Institute for Research in Molecular Medicine (INFORMM) in USM